Siemens EDA

We must embed context and domain-aware AI throughout the EDA workflow to shift from reactive to predictive semiconductor design.

3D IC enables post-Moore's Law scaling through vertical chiplet integration while introducing new challenges like thermal hotspots, multi-layer complexity, testing difficulties and design verification bottlenecks.

Hardware, as an abstraction of software, requires shift-left simultaneous optimization before you can commit to silicon, delivering superior performance and efficiency through unified design flows.

Industry acceleration toward 3nm, 2nm and future nodes, demands advanced-node readiness spanning tools, design methodologies and process expertise to navigate escalating complexity and cost pressures.

Shift-left verification is a critical chip design strategy, with AI accelerating early defect detection through intelligent pattern recognition, automated testing, yield prediction and optimized coverage.

Ecosystem integration unifies design flows, leverages partnerships and streamlines foundry collaboration to accelerate time-to-market and drive competitive advantage.